The current version is , which updated guidance for lead-free soldering and advanced defect mechanisms. 1. Design for Manufacturing (DFM)
The most recent release is , published in late 2024. It includes updated guidance on lead-free soldering and newer defect mechanisms found in high-density mobile and automotive electronics. You can find the official version through the IPC Store . Complete Guide to BGA Design, Assembly & Defect Prevention ipc-7095 pdf