Mks Astron 2l Manual

Ignite the plasma using the Argon purge gas and allow it to stabilize.

Run oxygen through the cell for 5 minutes to clear moisture. mks astron 2l manual

MKS ASTeX ASTRON 2L is a high-performance Remote Plasma Source (RPS) primarily used in semiconductor manufacturing for chemical vapor deposition (CVD) chamber cleaning and thin-film processing. This system is designed as a self-contained, "lid-mount" unit that generates reactive gas radicals—like atomic fluorine from cap N cap F sub 3 Ignite the plasma using the Argon purge gas

The Astron 2L (and its sibling, the Astroni) uses a silent corona discharge to convert oxygen into high-concentration ozone. Up to 2 liters per minute (Lpm). This system is designed as a self-contained, "lid-mount"

The MKS Astron 2L manual outlines the device's key components, including the sensor, electronics, and valve. The sensor measures the gas flow rate using a thermal mass flow measurement technique, while the electronics process the sensor signal and generate a control output. The valve, which is typically a proportional solenoid valve, regulates the gas flow rate based on the control output.

: Typically requires 100% Argon (Ar) for plasma ignition. After ignition is stabilized (1 to 4 Torr), the process gas (NF3) is introduced and the Argon can be removed.