Set R2 = 100kΩ, then R1 = 212.5kΩ (use 215kΩ 1% resistor).
| Pin No. | Symbol | Function Description | |---------|--------|----------------------| | 1 | VIN | Input voltage supply. Bypass with 1µF ceramic capacitor to GND. | | 2 | GND | Ground connection. Connected to thermal pad if present. | | 3 | EN | Enable pin. Active high (logic >1.2V). Tie to VIN if unused. | | 4 | NC / BYP | No connect or bypass capacitor pin for noise reduction. | | 5 | VOUT | Regulated output voltage. Output capacitor (1µF to 10µF) required. |
If you are designing a PCB, this section provides the footprint required for the component. Accurate dimensions ensure that your solder paste stencil and pad layouts are correct.
: Encapsulated in a 64-pin LQFP (Low-profile Quad Flat Package).
Set R2 = 100kΩ, then R1 = 212.5kΩ (use 215kΩ 1% resistor).
| Pin No. | Symbol | Function Description | |---------|--------|----------------------| | 1 | VIN | Input voltage supply. Bypass with 1µF ceramic capacitor to GND. | | 2 | GND | Ground connection. Connected to thermal pad if present. | | 3 | EN | Enable pin. Active high (logic >1.2V). Tie to VIN if unused. | | 4 | NC / BYP | No connect or bypass capacitor pin for noise reduction. | | 5 | VOUT | Regulated output voltage. Output capacitor (1µF to 10µF) required. | Tsum1pfr-lf Datasheet
If you are designing a PCB, this section provides the footprint required for the component. Accurate dimensions ensure that your solder paste stencil and pad layouts are correct. Set R2 = 100kΩ, then R1 = 212
: Encapsulated in a 64-pin LQFP (Low-profile Quad Flat Package). Bypass with 1µF ceramic capacitor to GND