: Footprint naming convention now includes specific component tolerances and thermal pad sizes. Producibility and Density Levels
: Includes updated guidelines for modern component packages that weren't fully addressed in previous versions. Heel, Toe, and Side Fillets Ipc-7352 Pdf
: Offers curated industry standards including IPC-7352. Ipc-7352 Pdf
: Introduces new mathematical models for better yields in high-density designs. Ipc-7352 Pdf
If you open the to Chapter 5 (Land Pattern Calculations), you will find formulas like:
". The primary standard for actual solder joint requirements remains IPC J-STD-001 Naming Conventions